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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

  • Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
  • Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
  • Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
  • Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
  • Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
Product Details:
Place of Origin: CN
Brand Name: SIGNI
Certification: ISO
Model Number: SS
Payment & Shipping Terms:
Minimum Order Quantity: 1PC
Packaging Details: WOODEN CASE
Delivery Time: 15 DAYS
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram
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Detailed Product Description
Material: DIAMOND Application: SAPPHIRE
OEM: Yes Size: As Per Required
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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field 

Product Features

 

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

 

This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.

 

Product Description

 

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.

 

Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.

 

Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.

 

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field 0

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field 1

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field 2

Contact Details
SIGNI INDUSTRIAL (SHANGHAI) CO., LTD

Contact Person: Zhao

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