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Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel

Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel

  • Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel
  • Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel
  • Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel
  • Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel
Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel
Product Details:
Place of Origin: CN
Brand Name: SIGNI
Certification: ISO
Model Number: SS
Payment & Shipping Terms:
Minimum Order Quantity: 1PC
Packaging Details: WOODEN CASE
Delivery Time: 15 DAYS
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram
Contact Now
Detailed Product Description
Material: DIAMOND Application: SAPPHIRE
OEM: Yes Size: As Per Required
Highlight:

8202390000 diamond cup wheel

,

SiC diamond cup wheel

,

8202390000 diamond grinding disc

Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel 

Product Description
Name Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel
Bond Vitrified bond
HS Code 8202390000
Products Range

1. Synthetic diamond powder /natural diamond powder
2. Electroplated diamond grinding wheel /electroplated saw blade/

electroplated diamond disc
3. Resin bond diamond grinding wheel/ resin bond saw blade/
4. Metal bond diamond grinding wheel/metal bond saw blade
5. Vitrified bond diamond grinding wheel
6. Diamond Microdermabrasion tips

Features Stable quality
Fast delivery
Reasonable price
OEM/ODM production
Logo Acceptable, can be lettering according to the customers’ requirements.
Sample lead time 3-7 days
Delivery time 7-15 days. Large quantity please contact us to discuss
Usage Mainly used for machining tungsten carbide, PCD, PCBN, ceramic, cermets, crystal tungsten, carbide

 

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

 

This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.

 

Product Description

 

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.

 

Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.

 

Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.

 

Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel 0

Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel 1

Diamond Back Grinding Wheel For Silicon Sapphire Wafers Cut Glass Dremel Diamond Wheel 2

Tag:

6A2 diamond sharpening wheel,

50mm glass grinding wheel,

1A1 Diamond Grinding Wheel

Contact Details
SIGNI INDUSTRIAL (SHANGHAI) CO., LTD

Contact Person: Zhao

Send your inquiry directly to us
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