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Diamond Lapping Slurry For Metal Polishing Precise Polishing Of Stainless Steel Workpiece

Diamond Lapping Slurry For Metal Polishing Precise Polishing Of Stainless Steel Workpiece

  • Diamond Lapping Slurry For Metal Polishing Precise Polishing Of Stainless Steel Workpiece
Diamond Lapping Slurry For Metal Polishing Precise Polishing Of Stainless Steel Workpiece
Product Details:
Place of Origin: shanghai
Brand Name: SIGNI
Payment & Shipping Terms:
Packaging Details: CARTON
Payment Terms: T/T,L/C,PAYPAL,WEST UNION
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Detailed Product Description
Color: As Per Clients' Request Packing: Plastic Bottle
Size: As Per Clients' Order
High Light:

PDS 0.25μm Diamond Slurry Polishing

,

8μm Diamond Slurry Polishing

,

8μm diamond lapping slurry

Diamond lapping slurry for metal polishing precise polishing of stainless steel workpiece

 

Specifications

1. Diamond slurry manufacturer for ten years
2. Lot-to-lot Consistency
3. Diamond slurry with ISO9001 certificate

Diamond Suspension for metal polishing

 

 

Our diamond slurries are made with diamond particles completely dispersed in the mixed liquids. They have fine chemical-mechanical performance and are widely used for lapping and precision polishing of wafer substrates, compound crystals, optical devices, LCD, gems, metallic works, etc.

 

CLASSIFICATIONS & MAIN APPLICATION FIELD

  1. PDS Polycrystaline Diamond Slurry
  2. MDS Monocrystaline Diamond Slurry
  3. QDS Quasi Poly diamond slurry
  4. NDS Nano Diamond Slurry

 

POLYCRYSTALINE DIAMOND SLURRY(PDS)

 

CHARACTERISTICS

 

 

 

1. Fine polycrystaline diamond materials.

 

(1) Superhigh cutting force and surface finish in the processing of high hardness wafers.

 

(2) Different carriers are suitable for different fields.

 

Size(μm) 0.25 0.5 0-1 1-3 2-4 4-8
Medium Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil

 

MONOCRYSTALINE DIAMOND SLURRY(MDS)

 

CHARACTERISTICS
1. Fine particle shapes.

  1. Strict size control.
  2. Unique compound design for different application fields.

 

AVAILABLE SIZES(Ref Poly specs)

 

QUASI POLY DIAMOND SLURRY(QDS)

 

CHARACTERISTICS
1. Economical alternatives of PDS.
2. Similar polishing effects with PDS in the processing of kinds of semiconductor chips.

 

Size(μm) Medium Size(μm) Medium Size(μm) Medium
0.05 Water/Oil 0-1 Water/Oil 8-16 Water/Oil
0.08 Water/Oil 1-2 Water/Oil 10-20 Water/Oil
0.1 Water/Oil 1-3 Water/Oil 20-30 Water/Oil
0.2 Water/Oil 2-4 Water/Oil 30-40 Water/Oil
0.25 Water/Oil 4-8 Water/Oil 40-60 Water/Oil
0.5 Water/Oil 6-12 Water/Oil    

 

NANO DIAMOND SLURRY(NDS)

 

CHARACTERISTICS
1. Unique loose structure of spherical crystallite of nano diamond.
2. Superfine dispersing effects because of unique ultra-dispersing techniquee.
3. Angstrom-level accuracy surface finish.

 

Size(μm) 50 80 100 150 200 300 400 500
Medium Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil Water/Oil

 

 

 

Diamond Slurry For Polishing

 

Our diamond slurries are made with diamond particles completely dispersed in the mixed liquids. 3 series according to the constituents:

 


Monocrystaline Diamond Slurry(MDL):Good removal effects, suitable for lapping & polishing of hard material.

 


PolycrystalineDiamond Slurry(PDL): Superb tenacity & self-sharpening features. Suitable for lapping and polishing of precision metal material, optical crystals, ceramics and hard materials.

 


Nano Diamond Slurry(NDL): Good dispersing stability & suitable for precise surface treatment.

ultra-dispersing effect Nano diamond slurry(NDS) lapping and precision polishing

Specifications

1.Widely used for lapping and precise polishing.
2.Fine chemical-mechanical performance.
3.Water or oil basis

 

Our diamond slurries are made with diamond particles completely dispersed in the mixed liquids. They have fine chemical-mechanical performance and are widely used for lapping and precision polishing of wafer substrates, compound crystals, optical devices, LCD, gems, metallic works, etc.

 

CLASSIFICATIONS & MAIN APPLICATION FIELD

PDS Polycrystaline Diamond

 

 

Characteristics:

★ Unique loose structure of spherical crystalline of nano diamond.

★ Superfine dispersing effects because of unique ultra-dispersing technique.

★ Angstrom-level accuracy surface finish.

Available Sizes:

Size(nm)

50
80
100
150
200
300
400
500
Media
Water / oil
Water / oil
Water / oil
Water / oil
Water / oil
Water / oil
Water / oil
Water / oil

Remarks: Special sizes can be tailor-made.

Application:

1, Semiconductor wafer polishing: monocrystalline silicon wafer, polycrystalline silicon wafer, sapphire wafer, SiC wafer, etc..

2, Magnetic recording materials polishing: computer hard disk substrate, computer hard disk head.

Diamond Lapping Slurry For Metal Polishing Precise Polishing Of Stainless Steel Workpiece 0

Contact Details
SIGNI INDUSTRIAL (SHANGHAI) CO., LTD

Contact Person: Zhao

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